The U.S. Department of Defense has invested an additional $160 million in its microelectronics capabilities through the Microelectronics Commons, a collaborative network of technology hubs. This funding marks a significant milestone for the Biden-Harris Administration’s bipartisan CHIPS and Science Act, aimed at strengthening America’s global leadership in microelectronics.
The majority of the funding, $148 million, will support eight established hubs, including those led by Massachusetts Technology Collaborative, University of Southern California, and North Carolina State University. These hubs will focus on building infrastructure, supporting operations, and accelerating workforce development across the country.
An additional $10 million will be allocated to enhance shared access to critical Electronic Design Automation tools and cloud computing resources. The funding also supports a Cross-Hub Enablement Solution project that aims to streamline lab-to-fab pathways for microelectronics prototyping.
“We’re making investments today that will bolster global security tomorrow,” said Dr. Arati Prabhakar, assistant to the President for Science and Technology. “Semiconductors are key to next-generation technologies, including artificial intelligence and 5G.”
The Microelectronics Commons network recently convened its 2024 Annual Meeting, gathering industry leaders and experts to discuss progress and future plans. The event highlighted the importance of ongoing investments in lab-to-fab pathways and the nation’s potential to lead in microelectronics.
This monumental investment represents a significant step forward for the U.S. semiconductor industry, with stakeholders optimistic about America’s potential to lead in an era where advanced microelectronics are critical to national security.
Source: https://www.defense.gov/News/Releases/Release/Article/3961172/department-of-defense-invests-additional-160-million-in-chips-act-funds-to-prop