AMD has shipped its Instinct MI350 series to customers, marking a significant milestone in the company’s advancement of AI technology. The new chip is part of the next generation of AMD’s Instinct family and offers improved performance per card.
The Instinct MI350 package features eight HBM3E 12-high stacks around central compute tiles and two I/O dies. The GPU package is soldered onto its OAM board to create an OAM package that can be installed in servers.
The UBB (Universal Base Board) system, which houses up to eight GPUs, has a similar design to the previous generation AMD Instinct MI325X board. The new design includes a heatsink for the PCIe retimers and a SMC for management.
AMD also offers a liquid-cooled version of the MI350 chip, known as the MI355X, which allows for higher TDP and performance per card.
The Instinct MI350 UBB system is expected to ramp up production this year and features 2304GB of HMB3E memory on each UBB. The system’s weight and size are impressive, with estimates suggesting it could weigh over 600 pounds when fully assembled.
Unfortunately, AMD has not released information on the vendor or configuration options for partially populated systems, which may be a limitation for customers who want to purchase individual GPUs without committing to full configurations.
Source: https://www.servethehome.com/this-is-the-amd-instinct-mi350