Apple is reportedly working on a powerful new chip for the iPhone 18 Pro, featuring TSMC’s next-gen 2nm fabrication process and advanced WMCM (Wafer-Level Multi-Chip Module) packaging. This combination promises improved performance, reduced size, and increased power efficiency.
The new A20 chip will allegedly be manufactured by TSMC in late 2025, with the company establishing a dedicated production line at its Chiayi P1 fab. The WMCM packaging method allows for more complex systems, custom accelerators, and optimized communication between components, resulting in better overall performance.
Only the iPhone 18 Pro models are expected to be equipped with this advanced chip, which will also feature 12GB of RAM due to the new packaging method. This marks a significant shift in Apple’s chip design, moving from InFO (Integrated Fan-Out) packaging to WMCM.
The 2nm technology represents a generation of chip-making advancements, where smaller transistors allow for faster and more power-efficient devices. Analyst Ming-Chi Kuo has previously mentioned that this new tech will be exclusive to Pro-branded iPhones, highlighting the significance of this development in mobile tech.
Source: https://www.phonearena.com/news/iphone-18-pro-may-go-full-genius-mode-with-this-secret-chip-tech_id171601