Apple is set to revolutionize its iPhone lineup with next-generation technology from Taiwan Semiconductor Manufacturing Company (TSMC). The iPhone 18, expected to launch in 2026, will utilize TSMC’s cutting-edge 2-nanometer fabrication process combined with advanced new packaging methods.
According to reports, Apple has established a dedicated production line at TSMC’s Chiayi P1 fab for the new technology. This move comes as TSMC plans to start manufacturing 2nm chips in late 2025 and expects its WMCM packaging monthly capacity to reach 10,000 units by 2026.
The new packaging method, WMCM, allows for more complex systems to be integrated into a single package. This is a significant upgrade from the previous InFo packaging, which focuses on individual chip optimization. The iPhone 18 Pro models are likely to use TSMC’s next-generation 2nm processor technology due to cost concerns.
Analysts predict that the iPhone 18 Pro will feature 12GB of RAM and boasts increased processing speed and power efficiency thanks to smaller transistor sizes. This marks a significant improvement over earlier versions, with the A19 chip technology in this year’s upcoming iPhone 17 lineup already showing promise.
Source: https://www.macrumors.com/2025/06/23/iphone-18s-a20-chip-packaging-tsmc