Diabetic foot ulcers are notoriously slow to heal due to reduced blood flow and endothelial cell dysfunction. Thrombospondin-1 (TSP-1) is a major contributor to this issue, as it inhibits the growth of new blood vessels crucial for tissue repair. Researchers have made a significant breakthrough in addressing this barrier with a novel therapeutic solution.
A team of Chinese researchers has developed an innovative wound dressing that combines engineered extracellular vesicles targeting TSP-1 levels with a GelMA hydrogel. The approach has shown to significantly enhance wound healing and blood vessel formation in diabetic mice, offering hope for more effective treatments. By utilizing microRNA miR-221-3p, which targets and downregulates TSP-1 expression, researchers restored endothelial cell function.
In animal trials, the composite dressing dramatically accelerated wound healing, with a notable increase in vascularization and a 90% wound closure rate within just 12 days. This breakthrough could revolutionize how we approach diabetic wound care, improving patients’ quality of life significantly. The technology could be adapted for other chronic wounds and even regenerating tissues like bone and cartilage, opening up exciting possibilities in regenerative medicine.
Source: https://www.news-medical.net/news/20250808/Study-unveils-a-novel-therapeutic-solution-for-diabetic-wound-healing.aspx