Apple is set to switch to a new chip packaging technique that will give it greater flexibility in producing iPhone models. The company has partnered with Eternal Materials to use a new method called Wafer-level Multi-Chi Module (WMCM) instead of the current Integrated Fan-Out (InFO) technology.
The change is expected to allow Apple to produce more variations in performance for its upcoming iPhone 18 models by mixing and matching different CPU, GPU, and Neural Engine combinations. This could lead to a wider range of chip configurations, enabling Apple to differentiate between various iPhone tiers, such as the Pro and M-series models.
InFO has been used in the past because it allows Apple to integrate non-CPU components into the chip package, improving memory performance. However, WMCM is better suited for wider configurations and can pack multiple dies into a single package while still maintaining compactness. This new technique will give Apple more flexibility in its chip production, enabling it to offer more options for its customers.
The switch to WMCM has been confirmed by analyst Ming-Chi Kuo, who has a strong track record of accurate supply chain information. The partnership with Eternal Materials marks an important step forward for Apple’s chip manufacturing process, and is expected to have significant implications for the company’s future product lineup.
Source: https://appleinsider.com/articles/25/08/12/a20-chip-developments-could-mean-more-iphone-variants-in-2026