Apple’s A-series and M-series chips rely on System-on-a-Chip (SoC) design, integrating CPU and GPU in a single package. However, a new report suggests the upcoming M5 Pro chip may deviate from this approach, featuring separate CPU and GPU components to improve performance and production yields.
Traditionally, computers used separate CPU and GPU components on distinct circuit boards. The iPhone’s SoC design integrates these components into a single unit, which has been adopted in other devices like Apple Silicon Macs.
In the M5 Pro chip, analyst Ming-Chi Kuo reports that Apple will use TSMC’s advanced N3P node and 2.5D packaging called SoIC-mH (molding horizontal). This method improves thermal performance, reducing heat issues, and boosts production yields by minimizing chip failures.
The new approach is expected to be used in M5 Pro, Max, and Ultra variants, with mass production slated for 1H25, 2H25, and 2026, respectively. The M5 series chips will utilize server-grade SoIC packaging, separate CPU and GPU designs, and advanced N3P node technology.
The change is notable, as earlier reports hinted at similar separation in the A-series chip, including RAM integration. This shift may also benefit Apple’s AI-powered Private Cloud Compute (PCC) infrastructure, which will receive high-end M5 chips for enhanced AI inferencing capabilities.
Source: https://9to5mac.com/2024/12/23/m5-pro-chip-could-separate-cpu-and-gpu-in-server-grade-chips