Apple is working on a new ultra-thin “iPhone 17 Air” that will launch next year, with prototypes measuring just 5-6 millimeters thick. However, the pursuit of an even thinner design has put Apple engineers in several challenges.
One major hurdle is fitting the battery and thermal materials into the device without compromising its performance. This issue was also highlighted earlier by a supply chain report. The iPhone 6 remains the thinnest iPhone ever made, with a measurement of 6.9mm.
The new iPhone will have to make compromises on other aspects of its design to achieve its ultra-thin goal. For example, it will only have a single earpiece speaker, unlike current models that feature two speakers. The device will also lack a physical SIM card tray due to Chinese telcos’ requirements for real-name registration systems.
Despite the challenges, Apple’s in-house 5G modem is expected to be one of the first features on the iPhone 17 Air. However, it still lags behind Qualcomm’s performance and lacks support for mmWave technology, which was introduced in the iPhone 12.
The iPhone 17 Air will be manufactured by Foxconn and has recently graduated from proto-1 to proto-2 status. With its ultra-thin design and Apple’s in-house 5G modem, the device is set to make a significant impact in the market.
Source: https://9to5mac.com/2024/11/25/iphoen-17-air-design-features