Sony’s use of liquid metal thermal paste in its PlayStation 5 (Pro) console may lead to more defects, particularly when the device is positioned vertically. The special seal that holds this thermal paste in place may not be tight enough, allowing it to flow onto the motherboard and cause two major issues.
Firstly, the APU’s heat cannot be properly dissipated due to reduced thermal conductivity, leading to chipset overheating and console crashes. Secondly, the electrically conductive liquid metal can lead to short circuits on the motherboard.
Complaints about this issue have increased over time, with more players reporting crashes when playing games for extended periods. The problem primarily affects the launch model, but has also affected revised versions like the PS5 Slim. Sony has improved design in these revisions, but the risk persists due to ongoing use of liquid metal.
The defective cooling system causes console overheating, especially during demanding game sessions. A recent survey found that about 3% of Path of Titans players are currently affected by this issue, up from 2% a few months ago. The long-term impact on console lifespan and user experience remains unknown.
Source: https://www.notebookcheck.net/Liquid-metal-in-Sony-s-PlayStation-5-Pro-might-cause-more-defects.1044675.0.html