Russia Unveils EUV Chipmaking Roadmap as ASML Fends Off Competitors

Russia has unveiled a roadmap to develop its own EUV (extreme ultraviolet) lithography machines, aiming to create less costly and complex equipment than ASML’s systems. The Russian semiconductor initiative, led by Nikolay Chkhalo from the Russian Academy of Sciences’ Institute of Microstructure Physics, plans to build EUV machines that offer competitive performance while lowering manufacturing and operational expenses.

The new machines will use a xenon-based laser source with an 11.2 nm wavelength, which offers a 20% improvement in resolution compared to ASML’s systems. However, this adjustment requires significant redesign of optical components, mask designs, and resists, as well as re-engineering of supporting technologies like laser sources and contamination control.

Development will proceed in three stages: foundational research, prototype creation, and factory-ready system deployment. The first stage will focus on identifying key technologies and testing initial components, while the second stage aims to create a prototype capable of processing 60 200-mm wafers per hour. The third stage will deliver a factory-ready system capable of processing 60 300-mm wafers per hour.

The timeline for completing these stages is unclear, but experts believe it may take a decade or more to design and deploy the new EUV lithography systems. This is because the development of such complex technology requires significant investment and expertise.

Source: https://www.tomshardware.com/tech-industry/russia-plans-euv-chipmaking-tools-that-it-says-will-be-cheaper-and-easier-to-build-than-asmls-country-outlines-new-roadmap-to-smaller-chips