The US government has finalized funding deals with three major companies – Samsung, Amkor, and Texas Instruments (TI). The agreements are part of the CHIPS Act program aimed at boosting the country’s semiconductor industry.
Samsung will receive up to $4.745 billion in funding to build a 2nm-capable fab and an advanced packaging facility in the US. The project is expected to create over 17,000 jobs during construction phase, with 4,500 permanent manufacturing roles added within five years. The company’s 2nm process technology will support aerospace, automotive, and defense industries.
Amkor, a leading outsourced semiconductor assembly and test company, has secured $407 million in funding for an advanced packaging facility in Arizona. The project is expected to generate over 4,500 jobs during construction phase.
TI has secured up to $1.6 billion in CHIPS Act funding to expand its semiconductor manufacturing in Texas and Utah. The initiative aims to create thousands of new jobs and equip the company’s cleanrooms with advanced tools for logic production.
Source: https://www.tomshardware.com/tech-industry/samsung-amkor-and-ti-finalize-chips-deals-2nm-and-advanced-packaging-coming-to-u-s